PCB
                
                除了製造,我們更希望能提升您的市場競爭力
                透過在台灣擁有UL、ISO 和 QS 認證的生產線,我們能滿足客戶訂單的種類,從1片的快單,到大量產的訂單。我們知道,PCB打樣階段的效率和準確性是客戶是否能夠領先市場的重要階段,亦是讓最終產品能夠快速度上市的關鍵。因此,不論在哪個階段或是什麼樣的訂單數量,我們總是以始終如一的態度面對客戶每一次的訂單需求。
                在許多情況下,透過瞭解客戶的需求,以及對客戶的瞭解,再加上對不同規模產線的整合,我們在製造樣品的階段,就針對客戶量產時可能面對的問題,提供建議跟諮詢,以優化生產效率跟成本,提升客戶整體市場競爭力。
                             
            
            
                
                                
                    
                    
製程能力
                
                
                Laminate Material
                
                    
                        | Base Material | FR-4 TG135, TG150, TG170 | 
                    
                        | CEM1 | 
                    
                        | CEM3 | 
                    
                        | Rogers 3, 4 and 5 series | 
                    
                        | Arlon | 
                    
                        | Nelco 4000-13 | 
                    
                        | Alμminμm - 2L | 
                    
                        | Ceramic | 
                    
                        | Kapton | 
                    
                        | BT Material | 
                    
                        | Material Thickness | 3~240 mil (0.076mm ~ 6mm) | 
                    
                        | Min. board Thickness | 4mil. (0.1mm) - 2L | 
                    
                        | 14mils (0.4mm) - 4L | 
                    
                        | 24mils (0.6mm) - 6L | 
                    
                        | Max. / Min. Layer | 1 ~ 20L - Mass-Pro. | 
                    
                        | 22 ~ 26 L - Samples | 
                    
                        | Cu. Thickness | 0.3 ~ 10 Oz - Mass-Pro. | 
                
                
                Pattern Design
                
                    
                        | Min. Line-width | 3 mils ( 0.076 mm ) -Mass-Production. | 
                    
                        | Min Spacing | 3mils (0.076mm) - Mass-Production | 
                    
                        | Image Distortion | (+/- 20%) | 
                    
                        | Gold Thickness Range | 3~50μ" | 
                    
                        | Open / Short | YES | 
                    
                        | Bow & Twist | 0.75% | 
                
                
                Solder mask
                
                    
                        | Type Available | Taiyo, Tamura, Onstatic | 
                    
                        | Green, Black, Blue, Red, White, Purple, Clear | 
                    
                        | Solder mask Registration tol. | +/-3 mil | 
                    
                        | Min.Width S/M Bridge | 4 mil | 
                
                
                Peelable Mask
                
                    
                        | PeelableMask Type | Peters SD2955, SD2954,SD2952 | 
                    
                        | PeelableMask Thickness | 200μm | 
                
                
                Tolerance
                
                    
                        | Routing | +/- 0.005" | 
                    
                        | Feature to Hole | +/- 4 mil | 
                    
                        | Hole to Hole | +/-3 mil | 
                    
                        | Punching | +/- 4 mil | 
                
                
                V-Cut
                
                    
                        | V-grove Depth | +/-10% | 
                    
                        | Min. Unit / Panel size | 100 mm | 
                    
                        | Min. Unit / Panel thick. | 3.2 mm | 
                
                         
                
                Surface Treatment
                
                    
                        | HASL Thickness Range | 80~1000 μm | 
                    
                        | Entek Thickness Range | 0.2~0.3 μm | 
                    
                        | Electroless Nickel Thickness | 100~200 μ" | 
                    
                        | Electroless Gold Thickness | 2~10μ" Max | 
                    
                        | Wire Bonding Gold Thickness | 5~10μ"Max | 
                    
                        | Lead Free HASL | 80~1000 μm | 
                    
                        | Immersion Silver | 6 ~12 μ" | 
                    
                        | Immersion Tin | 30~40 μ"(Include copper) | 
                    
                        | 15~20 μ"(Tin only) | 
                    
                        | Flux Thickness Range | none | 
                    
                        | Carbon Print Thickness | per resistor request | 
                    
                        | Carbon Print Res. | per request | 
                
                
                Drilling
                
                    
                        | Min. Final Hole Size | 6 mils ( 0.15 mm ) - Mechnical | 
                    
                        | Size | 4 mils ( 0.1 mm ) -Laser Drill | 
                    
                        | Hole size tol. | PTH ±3 mil (+/-2mil for Press Fit ) | 
                    
                        | NPTH ±2 mil | 
                    
                        | Hole location tol. | +/-3 mil | 
                    
                        | Layer to layer | +/-3 mil | 
                    
                        | Registration tol. |  | 
                    
                        | Fiducial Mark Tolerance | +/-20% | 
                    
                        | Board flatness Tolerance | 0.75% | 
                
                
                Special Requirement
                
                    
                        | Epoxy In Holes |  | 
                    
                        | Vias In pad |  | 
                    
                        | Blind/Buried Vias |  | 
                
                               
            
            
                
                                
                    QUICK TURN PRICE
                    Testing and tooling included
                 
                                
                
                
                    The dimensions below are the overall dimension per shipping lot.
                    
                    Unit is in sq. inch.       Currency: USD
                    
                    Ex:  Price of 495 sq. inches two layers board in 4 working days is $390.
                 
                
                    Prices are based on standard spec, FR4 (Tg130), 1.6mm, up to 1oz start copper thickness, HASL finished, green solder mask and white silk screen, min. 4/4 mil trace width/space, min via 12 mil.
                
                
                
                Lead time: 
                
                    We start our working day (Monday to Friday) from 8:00am and finish at 20:00pm(Taiwan time). The lead time start from the first working 8:00am and boards will be shipped out before 20:00pm of the last working day. For example, if we receive your 2L job order with over all dimension 1480 Sq inches which requires 3 working days at 19:00 on Monday, we will ship it out no later than 20:00 that Thursday. 
                
                    
             
            
            
                
                    
                        
                                                
                            
空板樣品
                        
                                                
                        
                            
                            
                            
                                
                                    
                                    
                                        
3 mils trace, 3 time lamination, 2 laser drill
                                    
                                 
                             
                            
                            
                                
                                    
                                    
                                        
Blind and burried via, edge plated,
                                    
                                 
                             
                            
                            
                            
                            
                            
                            
                            
                            
                                
                                    
                                    
                                        
Impendance control, epoxy filled via
                                    
                                 
                             
                            
                            
                                
                                    
                                    
                                        
Thick board with 6 mils via