PCB

除了製造,我們更希望能提升您的市場競爭力

透過在台灣擁有UL、ISO 和 QS 認證的生產線,我們能滿足客戶訂單的種類,從1片的快單,到大量產的訂單。我們知道,PCB打樣階段的效率和準確性是客戶是否能夠領先市場的重要階段,亦是讓最終產品能夠快速度上市的關鍵。因此,不論在哪個階段或是什麼樣的訂單數量,我們總是以始終如一的態度面對客戶每一次的訂單需求。

在許多情況下,透過瞭解客戶的需求,以及對客戶的瞭解,再加上對不同規模產線的整合,我們在製造樣品的階段,就針對客戶量產時可能面對的問題,提供建議跟諮詢,以優化生產效率跟成本,提升客戶整體市場競爭力。



製程能力

Laminate Material

Base Material FR-4 TG135, TG150, TG170
CEM1
CEM3
Rogers 3, 4 and 5 series
Arlon
Nelco 4000-13
Alμminμm - 2L
Ceramic
Kapton
BT Material
Material Thickness 3~240 mil (0.076mm ~ 6mm)
Min. board Thickness 4mil. (0.1mm) - 2L
14mils (0.4mm) - 4L
24mils (0.6mm) - 6L
Max. / Min. Layer 1 ~ 20L - Mass-Pro.
22 ~ 26 L - Samples
Cu. Thickness 0.3 ~ 10 Oz - Mass-Pro.

Pattern Design

Min. Line-width 3 mils ( 0.076 mm ) -Mass-Production.
Min Spacing 3mils (0.076mm) - Mass-Production
Image Distortion (+/- 20%)
Gold Thickness Range 3~50μ"
Open / Short YES
Bow & Twist 0.75%

Solder mask

Type Available Taiyo, Tamura, Onstatic
Green, Black, Blue, Red, White, Purple, Clear
Solder mask Registration tol. +/-3 mil
Min.Width S/M Bridge 4 mil

Peelable Mask

PeelableMask Type Peters SD2955, SD2954,SD2952
PeelableMask Thickness 200μm

Tolerance

Routing +/- 0.005"
Feature to Hole +/- 4 mil
Hole to Hole +/-3 mil
Punching +/- 4 mil

V-Cut

V-grove Depth +/-10%
Min. Unit / Panel size 100 mm
Min. Unit / Panel thick. 3.2 mm
     

Surface Treatment

HASL Thickness Range 80~1000 μm
Entek Thickness Range 0.2~0.3 μm
Electroless Nickel Thickness 100~200 μ"
Electroless Gold Thickness 2~10μ" Max
Wire Bonding Gold Thickness 5~10μ"Max
Lead Free HASL 80~1000 μm
Immersion Silver 6 ~12 μ"
Immersion Tin 30~40 μ"(Include copper)
15~20 μ"(Tin only)
Flux Thickness Range none
Carbon Print Thickness per resistor request
Carbon Print Res. per request

Drilling

Min. Final Hole Size 6 mils ( 0.15 mm ) - Mechnical
Size 4 mils ( 0.1 mm ) -Laser Drill
Hole size tol. PTH ±3 mil (+/-2mil for Press Fit )
NPTH ±2 mil
Hole location tol. +/-3 mil
Layer to layer +/-3 mil
Registration tol.
Fiducial Mark Tolerance +/-20%
Board flatness Tolerance 0.75%

Special Requirement

Epoxy In Holes
Vias In pad
Blind/Buried Vias


空板樣品

3 mils trace, 3 time lamination, 2 laser drill

Blind and burried via, edge plated,

Color in black

color in red

color in white

Impendance control, epoxy filled via

Thick board with 6 mils via

Hard gold plate