PCB
PCB
| Unit of Measure | Effy Deal | |||
|---|---|---|---|---|
| Type of information needed | Production | Advanced | Remark | |
| Panel - Sizes | inch | 21”*24” | 21”*27” | |
| Panel - Non Usable Board space on Panel | # Inches Around Border | 0.39*0.39 | 0.39*0.39 | |
| Maximum Layer Count | # | 1-20L | 22-26L | |
| Minimum Core Thickness | mil | 2 | Y | |
| Minimum Prepreg Thickness | mm | 0.075 | 0.05 | |
| Minimum Layer Thickness | mm | 2L-8mil (0.2mm) 4L-14mil (0.35mm) 6L-22mil (0.55mm) |
2L-8mil (0.2mm) 4L-14mil (0.35mm) 6L-22mil (0.55mm) |
|
| Maximum Board Thickness | inch | 0.1 | 0.2 | |
| Maximum Copper Thickness | OZ | 10 | 10 | OUTER LAYER |
| Minimum Trace Width (Outer Layer) | mil | 3 | 2.5 | |
| Minimum Space (Outer Layer) | mil | 3 | 2.5 | |
| Minimum Trace Width (Inner Layer) | mil | 3 | 2 | |
| Minimum Space (Inner Layer) | mil | 3 | 2 | |
| Minimum Drilled Via | inch | 0.008 | 0.006 | |
| Maximum Copper Plating Aspect Ratio | # | 8 | 10 | |
| Minimum Laser Dilled Via | inch | 0.005 | 0.004 | |
| Maximum Laser Aspect Ratio | # | 1:2 | 1:2 | |
| Minimum Plated Hole Tolerance | mil | 3 | 2 | |
| Minimum Clearance - Copper Conductor to Mechanical Drilled Hole | mil | 7 | 6 | |
| Minimum Clearance - Copper Conductor to Laser Drilled Hole | mil | 7 | 6 | |
| Minimum Plated Hole Spacing (Drilled hole to hole) | mil | 12 | 10 | |
| Minimum Non Plated Hole Size | mm | 0.15 | 0.15 | |
| Maximum Non Plated Hole Size | mm | 6.5 | 6.5 | |
| Minimum NPTH to Edge of Board Spacing | mil | 10 | 8 | |
| Control Depth Drill - Minimum Dill Size | mm | 0.15 | 0.15 | |
| Control Depth Drill - Maximum Drill Size | mm | 6.5 | 6.5 | |
| Control Depth Drill - Minimum Depth Tolerance | mil | 3 | 3 | |
| Control Depth Drill Aspect Ratio | # | 0.6:1 | ||
| Back Drilling - Minimum Back Drill Drilled Diameter | mm | 0.15 | 0.15 | |
| Back Drilling - Minimum Drilled Hole Over Finished Hole Size | mm | 0.1 | 0.1 | |
| Back Drilling - Drill Depth Tolerance | mil | 5 | 5 | |
| Back Drilling - Number of Drilled Depths per Side | # | |||
| Via Fill Materials - Non-conductive | Name Of Materials | SR-500 | SR-500 | |
| Via Fill Materials - Conductive | Name Of Materials | AE3030 | AE3030 | |
| Impedance Control Tolerance<50 ohms | % | 10 | 7 | |
| Impedance Control Tolerance >=50 ohms | % | 7 | ||
| Impedance Control Tolerance -diff pairs | % | 10 | 7 | |
| Flatness (Warp per Inch) | % | <0.75 | <0.75 | |
| Surface Finish - ENIG | y/n | Y | Y | |
| Surface Finish - ENEPIG | y/n | Y | Y | |
| Surface Finish - Immersion Silver | y/n | Y | Y | |
| Surface Finish - Immersion Tin | y/n | Y | Y | |
| Surface Finish - OSP | y/n | Y | Y | |
| Surface Finish - HASL (Lead Free) | y/n | Y | Y | |
| Selective Hard Gold | y/n | Y | Y | |
| IPC-2221B D Coupon Test Capability | y/n | Y | Y | |
| Scoring Capabilities - Angles | C | V-cut angle (C): 30, 45, 60 | V-cut angle (C): 30, 45, 60 | |
| Scoring Capabilities - Offset Tolerance | # | V-cut tolerance : 1/3 of the board thickness | V-cut tolerance : 1/3 of the board thickness | |
| Scoring Capabilities - Optimum Remaining Web Thickness | # | Range of board thickness (H): 15.7~126mil (0.4~3.2mm) |
Range of board thickness (H): 15.7~126mil (0.4~3.2mm) |
|
| Scoring Capabilities - Remaining Web Tolerance | mil | 3 | 3 | |
| Scoring Capabilities - True Position Tolerance | mil | 3 | 3 | |
| Edge Connector Bevel Capabilities - Finger Angle | C | 30 | 30 | |
| Edge Connector Bevel Capabilities - Bevel Depth Tolerance | mil | 15 | 15 | |
| Profile Capabilities - Standard Router Bit Diameter | Preferred Bit Diameters | 1.6mm | ||
| Profile Capabilities - Minimum Internal Rout Radius | # | 0.8mm | ||
| Profile Capabilities - Minimum Routed Slot Width | # | 1.8mm | ||
| ODB++ version 8 capability | y/n | Y | Y | |
| IPC-2581 capability | y/n | Y | Y | |
| Inspection Capability - Flying Probe Netlist Test | y/n | Y | Y | |
| Inspection Capability - Peel Test | y/n | Y | Y | |
| Inspection Capability - Impedance Control TDR | y/n | Y | Y | |
| Inspection Capability - Cross Sections | y/n | Y | Y | |
| Inspection Capability - AOI | y/n | Y | Y | |
| Inspection Capability - Solderability | y/n | Y | Y | |
| Inspection Capability - Thermal Stress | y/n | Y | Y | |
| Inspection Capability - IPC II/III | y/n | Y | Y | |
| Embedded Capability - Buried Capacitance | y/n | Y | Y | |
| Embedded Capability - Buried Resistors | y/n | Y | Y | |
| Embedded Capability - Passives | y/n | Y | Y | |
| Minimum Soldermask Web Thickness | um | 7.5 | 7.5 | |
| Minimum Soldermask Swell | # | |||
| Soldermask Colors Available | Colors | Green, Black, Extra Black Matte, Blue, Red, Yellow, White, Purple, Clear | Green, Black, Extra Black Matte, Blue, Red, Yellow, White, Purple, Clear | |
| Preferred Soldermask Material | Material | Taiyo PSR4000, PSR2000, Tamura, Onstatic, Glossy, AMC, Nan Ya | Taiyo PSR4000, PSR2000, Tamura, Onstatic, Glossy, AMC, Nan Ya | |
| Silkscreen - Minimum Line Thickness | mil | 5 | ||
| Silkscreen - Minimum Text Height | mil | 30 | ||
FPCB
FPCB
| Item | Capability |
|---|---|
| Max. Board Size | 235 * 500 mm |
| Layers | Standard: 1-4 Layers Max: 6 Layers |
| Board Thickness | 0.06mm~0.3mm (single board) 0.12mm~0.3mm (Double-Layer PCB) |
| Copper Thickness | Max. Thickness: 2 OZ |
| Min. Thicnkess: 1/3 OZ | |
| Min.Drilled Hole Size-Mechanical | Standard: 0.2mm Max: 0.15mm |
| Min.Drilled Hole Size-Laser | 0.15mm |
| PTH Tolerance | ±0.075mm |
| NPTH Tolerance | ±0.05mm |
| Aspect Ratio | FPC: 1:2 Rigid+Flex PCB: 1:8 |
| Min. Clearance between the Drilled Hole and Flex Edge | 0.3mm |
| Min. Space between Pads | 0.1mm |
| Min. Clearance between the Pads and Flex Edge | 0.2mm |
| Min. Line Width/Spacing | Single layer PCB: Cu thickness 1/3OZ start: 2mil/2mil Cu thickness 1/2OZ start: 3mil/3mil Double-Layer PCB: Cu thickness 1/3OZ start: 3mil/3mil Cu thickness 1/2OZ start: 4mil/4mil |
| Soldermask Dam/Bridge | Normal: ±0.1mm Min.: ±0.075mm |
| Legend Trace Width | 0.2mm (±0.1mm) |
| Flex Length Tolerance | ±0.2 base on soft cut tooling ±0.1 base on hard cut tooling |
| Die & Shaping Tolerance | ±0.1mm |
| Via In PAD | POFV |
| Via Types used | Through-Hole Vias |
| Via Covering | Coverlay or LPI |
| Surface Finish | ENIG / OSP /immerse Tin |
| Conformal Coating Material | Polyurethane. UV type |
| Coverlay | Yellow/Black |
| Underfil | on BGAs |
| Impedance Control | OK (Tolerance +/-10%) |
| Stiffener material | PI/FR4/Staniness/Aluminum |
| PSA Material | 3M 467/468/9490/9469/9471 serials Tesa 4980 Nitto GA835 |
| Adhesive type | EPOXY/ACRYLIC |
| Cover Layer Laminate Tolerance | ±0.3mm |
| Adhesive Laminate Tolerance | ±0.3mm |
| Stiffener Laminate Tolerance | ±0.3mm |
PCBA
PCBA
| Item | Capability |
|---|---|
| SMT | Min. PCB size: 50 * 50 mm |
| Max. PCB size: 1000 * 560 mm | |
| Min. PCB thickness: 0.4 mm | |
| Max. PCB thickness: 5 mm | |
| Min. Part size: 01005 | |
| Min. BGA ball pitch: 0.25 mm | |
| Min. Diameter of BGA Ball: 0.15 mm | |
| Min. IC lead pitch: 0.4 mm | |
| Min. Space between two parts: 0.2 mm | |
| Through hole (DIP) | |
| Conformal Coating | |
| Programming | |
| Functional test | |
| Box build | |
| ICT test |